Hongye Two-Component Silicone Rubber Product Introduction
Product Overview
Hongye two-component silicone rubber is a kind of room temperature/heating curable silicone rubber that cures and forms after mixing Component A and Component B in a fixed ratio. It is specially designed for potting, bonding, sealing and insulation protection in fields such as electronic appliances, industrial manufacturing and precision molds. After curing, the rubber features excellent mechanical properties and strong stability, which can meet the needs of large-scale industrial production and harsh working condition protection, making it an ideal silicone material for high-end manufacturing.
Core Performance Features
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Curing Characteristics: Fast curing at room temperature or by heating after mixing Component A and B in proportion, with accurate ratio, long operating time window and adjustable curing speed. It achieves uniform and defect-free deep curing, extremely low colloid shrinkage, no bubbles or cracks after molding, and its bonding and sealing performance is far better than single-component products.
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Electrical Properties: Outstanding insulation and voltage resistance, low dielectric loss, stable insulation resistance, excellent anti-leakage, anti-arc and anti-electromagnetic interference effects, comprehensively ensuring the safe operation of electronic components and circuit boards.
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Weather and Temperature Resistance: Long-term service in an ultra-wide temperature range of -60℃ to 250℃. It resists high and low temperature alternation, UV aging, damp heat and salt spray, maintaining stable performance in extreme working conditions such as outdoors, humidity and corrosion.
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Mechanical & Protection Performance: Customizable elasticity and hardness after curing, excellent shock absorption and impact resistance. It also features waterproof, dustproof, acid and alkali corrosion resistance, oil and solvent resistance, providing dual physical and chemical protection.
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Environmental Protection & Compatibility: No peculiar smell or harmful substances volatilized during curing, complying with RoHS and other electronic industry environmental standards. It has strong adhesion to metal, PCB, ceramic, plastic and other substrates, with wide compatibility, suitable for automatic dispensing and manual construction.
Typical Application Scenarios
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Potting, insulation and shock protection for electronic power supplies, controllers, PCB boards and new energy batteries
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Waterproof potting and solder joint sealing protection for LED modules, outdoor displays and lamps
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Sealing, insulation and temperature resistance protection for sensors, automotive electronics and wire harness connectors
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Precision mold making, bonding and elastic buffering of industrial parts
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Sealing, potting and long-term protection for small household appliances, instruments and photovoltaic modules
Usage Instructions
Mix Component A and B fully in the ratio marked on the product before construction, and remove mixed bubbles. The substrate surface must be cleaned, degreased, dedusted and dried. It can be cured by standing at room temperature or accelerated by heating. The mixed adhesive must be used up within the operating time window. Unopened components should be stored sealed in a cool and dry place, and moisture or mixed use of components is strictly prohibited. The performance remains stable within the shelf life.
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