HONG YE SILICONE’s Functional Electronic Potting Compound is a high-performance practical protective circuit sealing agent and versatile general use component potting resin. As a reliable standard electronic board encapsulant grade, it integrates multi-functional protection for electronic modules. It stably works at -60℃ to 220℃ with excellent comprehensive performance. It enriches our full product lineup including classic Electronic potting compound, heat-efficient Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
Product Overview
This two-component functional-grade potting compound includes addition and condensation curing formulas. Serving as a multi-purpose electronic protective material, it features waterproof, moisture-proof, flame-retardant, insulating and heat-dissipating functions. After mixing with curing agents, liquid colloid cures firmly to finish encapsulation, sealing, filling and pressure resistance. It delivers outstanding adhesion and thermal stability on PCB, CPU, PC and PMMA, ideal for multi-scenario electronic protection.
Technical Specifications
This standard electronic board encapsulant grade adopts low-volatility, high-strength formula. It resists corrosion, ozone and chemical erosion effectively. It absorbs internal thermal cycling stress to protect chips and gold bonding wires from damage. It features superior bonding strength on aluminum, copper and stainless steel. Viscosity, curing hardness and operating time support personalized functional customization.
Product Features & Advantages
1. Multi-Functional Integrated Protection: This practical protective circuit sealing agent covers dustproof, shockproof, temperature resistance and insulation to meet diverse electronic protection demands.
2. Universal Component Adaptability: The general use component potting resin fits most circuit boards and electronic components with stable sealing performance.
3. Extreme Temperature Resistance: Continuous operation at -60℃ to 220℃ relieves thermal expansion and contraction damage to precision components.
4. High Purity & Stability: Low volatile content avoids circuit pollution, ensuring long-term stable operation of electronic equipment.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir component A to disperse settled fillers evenly and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure complete functional curing.
3. Vacuum Defoaming: Place mixed colloid in a 0.01MPa vacuum container for 3 minutes defoaming for bubble-free pouring.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.
Application Scenarios & Commercial Value
Widely applied for encapsulation of LED modules, precision consumer electronics and industrial control circuit boards. This functional potting compound solves multi-environment electronic failure problems, stabilizes product performance, simplifies multi-scenario material selection, and effectively reduces production and after-sales maintenance costs for manufacturers.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS international standards, meeting global industrial electronic manufacturing specifications.
Customization Options
Customizable curing hardness, colloid viscosity and operating time are available to match personalized functional encapsulation requirements.
Production Process
Adopting standardized dust-free production and strict batch testing on adhesion, temperature resistance and curing stability, every batch of general use component potting resin is fully inspected to guarantee consistent functional quality.
FAQ
Q1: What is the core advantage of this product?
A: It is a multi-functional practical protective circuit sealing agent with comprehensive performance,
suitable for diversified electronic encapsulation scenarios.
Q2: Can stratified colloid after storage be used normally?
A: Yes. Even stirring before use can fully restore its original sealing and protective performance
without quality loss.
Q3: Is it suitable for precision circuit board encapsulation?
A: Absolutely. This standard electronic board encapsulant grade features low volatility and stable
insulation, perfect for precision PCB protection.
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