Product Overview
This two-component standard duty silicone potting product includes addition and condensation curing formulas, tailored for general industrial electronic encapsulation. After mixing with curing agents, the liquid colloid cures into a solid protective layer, providing waterproof, moisture-proof, flame-retardant and insulating protection. It features outstanding adhesion and thermal stability on PCB, CPU, PC and PMMA, perfectly catering to daily sealing, filling and pressure-resistant protection of electronic components.
Technical Specifications
This typical circuit sealing silicone adopts low-volatility, high-strength formula. It boasts superior resistance to corrosion, ozone and chemical erosion. It effectively absorbs internal thermal stress caused by high-temperature cycling, protecting chips and gold bonding wires. It forms stable bonding on aluminum, copper and stainless steel, with customizable viscosity, curing hardness and working time for diverse general service encapsulation needs.
Product Features & Advantages
1. Balanced Standard Duty Performance: This regular protective encapsulation material integrates dustproof, shockproof, temperature-resistant and insulating functions to meet daily electronic protection standards.
2. Wide Substrate Compatibility: The general service module potting compound fits most common electronic substrates and metal materials with stable sealing performance.
3. Extreme Temperature Stability: It operates steadily in -60℃ to 220℃ environments, relieving thermal expansion and contraction damage to electronic modules.
4. High Safety & Cost-Efficiency: Low volatile content avoids component contamination, reducing production defects and overall operational costs.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir component A to evenly disperse settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly in standard weight ratio to ensure consistent curing quality.
3. Vacuum Defoaming: Place mixed colloid in a 0.01MPa vacuum container for 3 minutes of defoaming to eliminate internal bubbles.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.
Application Scenarios & Commercial Value
Widely used for encapsulation and sealing of consumer electronics, LED modules and ordinary industrial control components. This typical circuit sealing silicone stabilizes electronic product performance, reduces environmental failure risks, simplifies manufacturers’ material selection, and effectively cuts procurement and after-sales maintenance costs for mass production.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001 quality management system, CE and RoHS international standards, meeting global general electronic manufacturing safety and environmental regulations.
Customization Options
Personalized adjustment of curing hardness, colloid viscosity and operating time is available to adapt to diverse standard duty encapsulation processes.
Production Process
Adopting standardized dust-free production and strict batch testing on adhesion, temperature resistance and curing stability, ensuring every batch of regular protective encapsulation material delivers reliable and uniform quality.
FAQ
Q1: What is the core positioning of this product?
A: It is a cost-effective general service module potting compound, ideal for mass standard-duty
electronic encapsulation scenarios.
Q2: Can stratified colloid be used normally after storage?
A: Yes. Even stirring before use can fully restore its original sealing and protective performance
without quality loss.
Q3: Is it suitable for long-term mass production?
A: Absolutely. This typical circuit sealing silicone features stable performance and simple operation,
perfectly suitable for large-scale standardized electronic production.
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