Product Overview
Available in addition and condensation curing versions, this conductive Electronic potting compound is engineered for encapsulation, sealing and gap filling of high-frequency electronic components. It delivers outstanding adhesion and thermal stability for PCB, PC, PMMA, CPU and multiple metal substrates including aluminum, copper and stainless steel. After curing, it operates steadily within -60℃ to 220℃, absorbs thermal cycling stress, and protects chips and bonding wires from temperature impact and electromagnetic radiation damage.
Technical Specifications
Blended with high-purity silver and graphite composite conductive fillers, this material achieves excellent EMI RFI suppression encapsulation performance without compromising silicone’s inherent durability. It features low volatile content, great ozone resistance and chemical erosion resistance. Its heat dissipation performance is identical to our flagship Thermally Conductive Potting Compound. Clients can customize conductivity, viscosity and cured hardness to fit different shielding frequency requirements.
Product Features & Advantages
Different from traditional insulating potting adhesives, our conductive shielding silicone boasts unique competitive strengths:
1. Powerful Shielding Capacity: Realize efficient EMI RFI suppression encapsulation to block internal and external electromagnetic wave mutual interference.
2. Stable Conductivity: Adopts scientific conductive filler module potting technology to maintain consistent electrical performance for long-term operation.
3. Electromagnetic Barrier: Build reliable electromagnetic interference barrier protection to prevent static accumulation and circuit malfunction.
4. All-Round Protection: Integrates shockproof, waterproof and anti-corrosion properties to adapt to complex industrial electromagnetic environments.
Application Scenarios
As a functional Electronic Encapsulation Adhesive, this conductive potting silicone is widely used for RF modules, wireless communication devices, automotive radar systems and industrial high-frequency controllers. It effectively reduces electronic noise and product failure rates, serving as an upgraded alternative to ordinary insulating Silicone Encapsulant for communication electronics industries.
Step-by-Step Usage Process
1. Pre-Stirring: Thoroughly stir Part A to redistribute settled conductive fillers and shake Part B evenly before mixing.
2. Accurate Proportioning: Mix two components strictly per official AB weight ratio to guarantee stable conductivity and shielding effect.
3. Vacuum Defoaming: Place blended conductive silicone inside a 0.01MPa vacuum chamber for 3 minutes to eliminate bubbles before perfusion.
4. Curing Guide: Support room-temperature and heating curing; complete curing takes 24 hours, affected by ambient temperature and humidity conditions.
Certifications and Compliance
All HONG YE SILICONE silicone products obtain ISO9001, CE and RoHS certifications. This conductive shielding potting material complies with international electromagnetic compatibility standards and global export regulations.
Customization Options
We provide tailored one-stop customization. Buyers can adjust conductive filler ratio, adhesive viscosity, shielding strength and curing cycle to match exclusive EMI shielding encapsulation solutions.
Production Process
We adopt dust-free sealed production and multi-index testing. Every batch undergoes conductivity and shielding efficiency detection to provide durable electromagnetic interference barrier protection for global communication electronic manufacturers.
FAQ
Q1: What is the core function of this conductive potting silicone?
A: It supports professional EMI RFI suppression encapsulation, realizes standardized conductive filler module
potting, and provides long-term electromagnetic interference barrier protection for high-frequency electronics.
Q2: Will raw material stratification influence shielding performance?
A: Stratification is normal for filler-containing silicone. Stir fully before use, and its conductivity and EMI shielding
performance remain unchanged.
Q3: Can this product replace dedicated shielding metal casings?
A: It can serve as auxiliary shielding encapsulation, perfectly cooperating with metal shells to enhance overall
electromagnetic protection for electronic modules.
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