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Flame-Retardant Electronic Potting Compound for Circuit Boar
Product No： HY-9020/HY-9030/HY-9040/HY-9050/HY-9055
Brand：Hong Ye Silicone
Product Usage：HONG YE SILICONE Electronic Potting Compound is a two-component addition-curing liquid silicone designed for encapsulating, sealing and protecting electronic components. Before curing, it consists of Part A and Part B. When mixed at 1:1 weight ratio, it cures at room temperature or under heat to form a flexible, durable protective layer with excellent waterproof, moisture-proof, flame-retardant, insulating and thermally conductive properties. It operates stably from -60℃ to 220℃ and bonds strongly with PC, PMMA, PCB, CPU and metals. Compliant with UL94, RoHS and ISO9001, it is widely used for LED displays, power supplies, battery modules, communication devices, transformers and industrial control modules.
Product Overview ：
Our Electronic Potting Compound is a professional-grade silicone encapsulant developed for applications requiring comprehensive protection of electronic components. As a leading manufacturer of liquid silicone rubber with over 25 years of experience, we optimize the formulation for low viscosity, deep curing capability, and excellent adhesion to diverse substrates. Unlike conventional epoxy potting materials, this addition-curing silicone produces no corrosive byproducts, allows rework after curing, and maintains flexibility across extreme temperatures. It is an ideal replacement for epoxy in applications demanding higher thermal cycling resistance, better shock absorption and longer service life.
Core Product Features & Advantages ：
Comprehensive protection: Provides waterproof, moisture-proof, dust-proof, anti-corrosion, insulation, thermal conductivity and shockproof functions, isolating components from harsh environments.
Extreme temperature resistance: Operates stably from -60℃ to 220℃, absorbing thermal stress to protect chips and gold wires from high-temperature cycles.
Strong adhesion and durability: Bonds well with PC, PMMA, PCB, CPU, aluminum, copper and stainless steel; low volatile content, high strength, ozone and chemical resistance.
Flame retardant safety: UL94 V-0 rated, self-extinguishing, prevents fire propagation in electronic devices, meeting international safety standards.
Reworkable after curing: Cured silicone can be cut open for component repair or replacement, and re-potted without leaving traces—unlike brittle epoxy.
Easy operation: Low viscosity, self-leveling, automatic bubble release, simple pouring process suitable for both manual and automated production.
Step-by-Step Usage Instructions /：
Preparation: Stir Part A thoroughly to resuspend settled fillers and ensure uniform consistency. Shake Part B well before use.
Proportional mixing: Mix Part A and Part B at 1:1 weight ratio, stir evenly for 2-3 minutes to achieve homogeneous blend.
Vacuum degassing (optional): Place mixed material in vacuum chamber at -0.08MPa for 3-5 minutes to eliminate air bubbles for void-free potting.
Potting and curing: Pour onto target electronic components. Room temperature full cure takes 24 hours; heated curing at 60-80℃ takes 1-2 hours for complete cure.
Application Scenarios：
LED display module encapsulation and sealing; power supply and adapter potting; battery module thermal management and protection; PCB conformal coating and filling; communication device encapsulation; transformer and inverter potting; automotive electronic controller sealing; railway signal equipment protection; solar junction box potting; industrial control module encapsulation; sensor and transducer protection; home appliance circuit board sealing. HONG YE SILICONE Electronic Potting Compound builds reliable waterproof, flame-retardant and insulating protection for diverse electronic applications.
Precautions：
Avoid contact with sulfur, phosphorus, nitrogen organic compounds, and ionic compounds of mercury, lead, tin and arsenic. Do not mix with condensation-type silicone or use containers that have previously held condensation-type silicone, as this will cause catalyst poisoning resulting in incomplete curing. Seal unused components tightly; mixed material should be used up at once. If material appears layered after long storage, stir thoroughly before use—this will not affect performance. Avoid contact with mouth and eyes.
FAQ ：
Q1: Can this potting compound be used for high-power electronic devices? A1: Yes, our HY-9050 and HY-9055 models feature enhanced thermal conductivity (≥0.5-0.6 W/m·K), specifically designed for high-power components like transformers and battery modules.
Q2: Is it possible to repair components after potting? A2: Yes, unlike brittle epoxy, cured silicone remains flexible and can be cut open for repair or replacement, then re-potted without leaving traces.
Q3: Can viscosity, curing time or other parameters be customized? A3: Absolutely. All parameters including viscosity, working time, curing speed, thermal conductivity, hardness and color can be tailored to customer requirements. Free samples are available for testing before bulk orders.
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